PIP分子复合材
PIP MOLECULE COMPOSITE
PIP分子复合材是一款由PI film与氟以及高分子材料结合而成的新型高分子材料，材料具有超薄、超平整度、完美的韧性等主要特性；它有力地结合了硅胶分子的热性能、缓冲性能以及PI的独特韧性及稳定度，超薄且平整的材料是与传统缓冲材最大之区别，其还具有厚度公差小、导热速度快、单个位置使用率高等优点，能满足许多有特殊要求的设备使用。主要适用于高要求的热压设备，可隔绝超高温产生的硅油与产品的直接接触，对温度有缓冲作用，使温度较为均匀，超级平坦的表面可防止异物的残留，以免影响热压头因有残留杂物而造成的热压效果，同时具有隔离保护作用。
PIP molecule composite is a composition of fluorine,PI film and polymer. It has very thin and flat characters. It integrates the heat property and cushioning from silicone molecule and the tenacity,stability from PI. Its advantages include that the tolerance of thickness is small and thermal conductivity performs well etc.It can isolate the silicone oil caused by high temperature to the products directly.
PI film化学结构图机特点：
PI FILM CHEMICAL STRUCTURE CHARACTRISTIC：
1、PI film化学结构具有超强的钢性及韧性，作为一种特种工程材料，已广泛应用在航空、航天、微电子、纳米、液晶、分离膜、激光等领域。
2、是目前已知综合性能最佳的有机高分子材料之一，耐高温达 400℃以上 ，长期使用温度范围-200~300℃，无明显熔点，高绝缘性能，103 赫下介电常数4.0，介电损耗仅0.004~0.007，属F至H级绝缘材料。
3、是作为导热及缓冲材料最完美的基材，有分子结构小、回复力量强等优点。
1. The chemical structure of PI film has hard tenacity. As a special engineering material, it has been applied to a lots of field such as aerospace,liquid crystal,laser etc.
2. PI film is one of the best organic polymer materials, its thermal-resistance performance reaches above 400℃. it can be used for long term under -200~300℃. high insulative performance. Dielectric loss data range between 0.004-0.007,it belongs to F-H grade insulative material.
3. It is the best base material for cushioning and heat conduction. Its molecule structure is small and its tensile strength performs well.
PIP高分子复合材结构图 ：
PIP polymer composite structure：
PIP高分子复合材料使用PI film为基础材料,结合各类高分子材料,可替代目前普通设备使用的氟材料、硅材料以及玻璃纤维等复合材料。
PIP polymer composite uses PI film as basic material, it combines kinds of polymer material, it can replace the ordinary fluorine material,silicone material and glass fiber composite etc.
表面拒油性示意图：
Anti-oil surface sketches：
产品型号Product model：
SIC-PIP50-100。
产品用途：
1、适用于各类新型（柔性屏、3D眼镜、OREDT、TP）COG与FOG绑定压合过程的防护、缓冲和隔离，可替代目前普通设备使用的氟材料、硅材料以及玻璃纤维等复合材料。
2、主要替代目前传统使用性能单一的压合材料，与传统压合材料比有更轻薄、更平整、导热快、受热均匀、不渗油等特点。
3、特别适用于超级恶劣环境(高温、耐油、高强度、高频率)生产环境下的使用。
Usages of product:
1. It can be applied to bonding procedure of COG and FOG for FPC,3D eyeglasses,OEDT and TP etc. As buffering tools.it can replace some composite glass fiber material such as fluorine,silicone etc.
2. It can replace traditional compress material majorly. Comparing to traditional composite materials, SIC products are more thin and flat. The thermal conductivity performs fast and evenly.
3. It can be applied to severe environment(high-temperature,high pressure,high frequency etc.)
产品特点：
1、材料薄、厚度公差极小、表面平整、导热均匀。
2、耐高压、耐高温、耐老化、高韧性、高导热、不出油、无渗透性。
3、良好的缓冲性、回弹性。
4、具有超强的稳定性，使用周期长，性能稳定。
Features of product:
1. Materials are thin and light, tolerance of thickness is small.thermal conductivity performs well.
2. High-pressure resistance,high-temperature resistance,ageing resistance etc.
3. Buffering performance and tensile resilience.
4. Stable performance.
产品规格：
1、（厚T：0.05mm*（宽W：5mm-500mm）*（长L：5-100m）;
2、SIC可按客户需求定做其他规格及颜色产品。
Product specifications:
1. (Thickness 0.05mm) * (width 5mm-500mm) * (length 5-100m).
2. Products can be customized upon requests.
性能参数PERFORMANCE
温度的稳定性&均匀性测试（上表格）:
相同位置不间断测试20次，取温度数据，差异不超过2度。
同时提高10度做测试，相同位置热压20次，数据温差仍不超过2度。
数据表明，产品在高温重复压合之后，温度及性能持续稳定，可有效增加产品良率及生产效率。
Temperature stability and uniformity test:
Test 20 times at a same place, difference of data does not exceed 2 degrees.
Increase 10 degrees to press at a same time, difference of data still do not exceed 2 degrees.
