低硬度导热夕胶片
LOW HARDNESS THERMAL CONDUCTIVE SILICONE
低硬度导热硅胶片(矽胶片)是高性能间隙填充导热材料,主要用于电子设备与散热片或产品外壳间的传递界面。具有良好的的粘性、柔性、良好的压缩性能以及具有优良的热传导率。使其在使用中能完全使电子原件和散热片之间的空气排出,以达到接触充分,增加其散热效果,同时具有一定的粘性,相比普通的绝缘导热材料在产品的安装过程中带来很大的方便性,不易脱落,便于操作。
Low hardness thermal conductive silicone is a high-performance filler. It is applied between product’s shell and cooling fin in the electronic equipment. It has good viscidity, softness and compression performance. It can eliminate the air between the components and cooling fins so that improves its heat dissipation. Comparing to ordinary insulative conductive material, it is more convenient and easy to be manipulated.
产品规格:
尺寸:宽200mm*长400mm(具体尺寸可根据客户要求而定)。
厚度:0.3~5mm(标准厚度),5mm~15mm(定做规格)。
厚度公差:T0.3~0.5mm±0.03mm、T1.0~1.5mm±0.06mm、T2.0~3.0mm±0.15mm、T4.0~5.0mm±0.25mm。
导热公差:≥1.0±0.08、1.0~2.0±0.2、2.5~4.0±0.35、4.0~6.0±0.40、6.0~8.0±0.5。
颜色区分:根据不同颜色来区分导热系数(见下图)。
Product specification:
Size: width 200mm * length 400mm(sizes can be customized upon requests)
Thickness: 0.3-5mm(standard),5mm-15mm(customized size)
Thickness tolerance:T0.3~0.5mm±0.03mm、T1.0~1.5mm±0.06mm、T2.0~3.0mm±0.15mm、T4.0~5.0mm±0.25mm。
Heat conduction tolerance: ≥1.0±0.08、1.0~2.0±0.2、2.5~4.0±0.35、4.0~6.0±0.40、6.0~8.0±0.5。
Color difference: heat conductivity coefficient will be differentiate by colors.
特点优势:
1、良好的热传导性与绝缘性,提高敏感电路及元器件的可靠性,延长使用寿命。
2、自然粘性、可压缩性及弹性、抗击减震吸音、使用方便。
3、持久耐热、耐电压、耐电弧、耐电晕、耐腐蚀、耐老化、拒水性、绝缘性、性能稳定。
4、工作湿度及温度范围广(-50℃~+180℃)。
Features of products:
1.Good heat conduction and insulation. Improves the ages of circuit and components.
2.Natural viscidity,compressibility and elasticity.
3.Thermal-resistance,voltage-resistance,corrosion-resistance,ageing-resistance etc.
4.Humidity and temperature of work are wide(-50℃~+180℃).
应用方式:
1、线路板及IC和散热片之间的填充。
2、需散热部件与散热设备或产品外壳间的填充。
Application modes:
Filler among circuit, IC and cooling fin.
Filler between cooling equipment and cooling parts or product’s shell.
适用产品:
电子设备、计算机、航空设备、开关电源、平板电视、移动设备、视频设备、网络产品、家用电器、可穿戴设备、医疗、COMBO、基放站等。
Applicable products:
Electronic equipment, computers,aerospace equipment,switches,FPTV,mobile devices, electronic gadgets,combo etc.
备注:SIC各类数据及参数仅供参考,各合作伙伴以自身设备实际测试结果为标准;因为数据受不同设备、使用环境、温度、产品类型、工艺条件等多方面因素而影响;
Remark: SIC performance data are only for reference. data may be changed based on different standards such as external temperature, equipments etc.